CVPublicationsTeachingEquipmentStudentsDepartment of Mechanical Engineering

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Publications

  1. Investigation of Microstructure and Mechanical Properties of Multi-layer Cr/Cr2O3 Coatings, X. Pang, K. Gao, F. Luo, Y. Emirov, A.A. Levin, A.A. Volinsky, Thin Solid Films, in press, 2008

  2. Simple Model of the Magnetoelectric Effect in Layered Cylindrical Composites, D.A. Pan, S.G. Zhang, A.A. Volinsky, L.J. Qiao, J. Phys. D: Appl. Phys., Vol. 41, No. 20, 205008, 2008

  3. Electro-deposition Current Density Effect on Ni/PZT Layered Magnetoelectric Composites Performance, D.A. Pan, S.G. Zhang, A.A. Volinsky, L.J. Qiao, J. Phys. D: Appl. Phys., Vol. 41, No. 19, 195004, 2008

  4. Shape and Size Effects on Layered Ni/PZT/Ni Composites Magnetoelectric Performance, D.A. Pan, S.G. Zhang, A.A. Volinsky, L.J. Qiao, J. Phys. D: Appl. Phys., Vol. 41, No. 17, 172003, 2008

  5. Concentric Ring Pattern Formation in Heated Chromium-gold Thin Films on Silicon, J.S. Randhawa, A. Bernfeld, M. Keung, A.A. Volinsky, D.H. Gracias, Appl. Phys Lett., Vol. 92, p. 211907, 2008

  6. Elastic Anisotropy Effect on Indentation-induced Thin Film Interfacial Delamination, B. Yang, A.A. Volinsky, Engineering Fracture Mechanics, Vol. 75, No. 10 pp. 3121-3130, 2008

  7. Annealing Effects on Microstructure and Mechanical Properties of Chromium Oxide Coatings, X. Pang, F. Luo, H. Yanga, Y. Wanga, K. Gao, A.A. Volinsky, Thin Solid Films, Vol. 516, pp. 4685-4689, 2008

  8. Giant Magnetoelectric Effect in Ni-PZT Composite Cylindrical Structure, D.A. Pan, Y. Bai, A.A. Volinsky, W.Y. Chu, L.J. Qiao, Appl. Phys. Lett., Vol. 92(5), p. 052904, 2008

  9. Mechanical Properties of Evaporated Gold Films. Hard Substrate Effect Correction , K. Du, X. Pang, C. Chen, A.A. Volinsky, Mat. Res. Soc. Symp. Proc. Vol. 1086E, U8.41, 2008

  10. Residual Stress in CVD-grown 3C-SiC Films on Si Substrates, A.A. Volinsky, G. Kravchenko, P. Waters, J. Deva Reddy, C. Locke, C. Frewin, S.E. Saddow, Mat. Res. Soc. Symp. Proc. Vol. 1069, D3.5, 2008

  11. Moisture Effects on Gold Nanowear, M. Pendergast, A.A. Volinsky, X. Pang, R. Shields, Mat. Res. Soc. Symp. Proc. Vol. 1085E, T5.10, 2008

  12. Adhesion and Friction of Chromium Oxide Coatings in Air and in Water,X. Pang, A.A. Volinsky, K. Gao, NACE International Corrosion 2008 Conference Proceedings, Paper 01555, March 16-20, New Orleans, LA, 2008

  13. Tip-induced Calcite Single Crystal Nanowear, R. Gunda, A.A. Volinsky, Mat. Res. Soc. Symp. Proc. Vol. 1049, AA5.15, 2008

  14. Pattern Formation During Nanowear of Gold Films, M.E. Pendergast, X. Pang, A.A. Volinsky, Mat. Res. Soc. Symp. Proc. Vol. 1059E, KK10.3, 2008

  15. Mechanical Properties of Single and Polycrystalline SiC Thin Films, J. Deva Reddy, A.A. Volinsky, C. Frewin, C. Locke, S.E. Saddow, Mat. Res. Soc. Symp. Proc. Vol. 1049, AA3.6, 2008

  16. Electrowetting Forces in an Electrowetting-Driven Oscillator, N.B. Crane, A.A. Volinsky, V. Ramadoss, M. Nellis, P. Mishra, X. Pang, Mat. Res. Soc. Symp. Proc. Vol. 1052, DD8.1, 2008

  17. Compliant MEMS Motion Characterization by Nanoindentation, J.G. Choueifati, C. Lusk, X. Pang, A.A. Volinsky, Mat. Res. Soc. Symp. Proc. Vol. 1052, DD6.24, 2008

  18. Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability,D.T. Read and A.A. Volinsky, Chapter 4 in Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, Volume 1 Materials Physics / Materials Mechanics, edited by Ephraim Suhir, Ephraim, Y.C. Lee, and C.P. Wong, Springer, New York, pp. 135-180, January, 2007

  19. Microstructure and Mechanical Properties of Chromium Oxide Coatings, X. Pang, A.A. Volinsky, K. Gao, Journal of Materials Research, Vol. 22, No. 12, pp. 3531- 3537, 2007

  20. Interfacial Microstructure of Chromium Oxide Coatings, X. Pang, K. Gao, H. Yang, L. Qiao, Y. Wang, A.A. Volinsky, Advanced Engineering Materials, Vol. 9, No. 7, pp. 594-599, 2007

  21. Nanoripples Formation in Single Crystals, M.E. Pendergast, R. Gunda, A.A. Volinsky, Mat. Res. Soc. Symp. Proc. Vol. 1021E, HH5.9, 2007

  22. Stress and Moisture Effects on Thin Film Buckling Delamination, P. Waters, A.A. Volinsky, Experimental Mechanics, Vol. 47, No. 1, 2006

  23. Mechanical Aspects of Anti-Corrosive Coatings Performance Tests, A.A. Volinsky, NACE International Corrosion 2006 Conference Proceedings, Paper 06041, March 12-16, San Diego, CA, 2005

  24. Novel Adhesion Test for Environmentally Assisted Fracture in Thin Films, A.A. Volinsky and P. Waters, Tri-Service Conference on Corrosion, November 14-18, 2005, Orlando, FL Proceedings Paper 06T104, 2005

  25. Application of the Standard Porosimetry Method for Nanomaterials, Y.M. Volfkovich, A.V. Sakars and A.A. Volinsky, International Journal of Nanotechnology, Vol. 2, No. 3, pp. 292-302, 2005

  26. Moisture Effects on Copper Thin Film Adhesion, P.J. Waters, A.A. Volinsky, Proceedings of IMECE: ASME 2005 Nov. 5-11, 2005

  27. Stress-Induced Periodic Fracture Patterns in Thin Films, A.A. Volinsky, N.R. Moody, D.C. Meyer, 11th International Congress on Fracture Proceedings, Turin, Italy, 2005

  28. Micro-fluidics Applications of Telephone Cord Delamination Blisters, A.A. Volinsky, P. Waters, G. Wright, Mat. Res. Soc. Symp. Proc. Vol. 855E, W3.16, 2004

  29. Sub-Critical Telephone Cord Delamination Propagation, A.A. Volinsky, P. Waters, J.D. Kiely, E. Johns, Mat. Res. Soc. Symp. Proc. Vol. 854E, U9.5, 2004

  30. Irradiated Single Crystals for High Temperature Measurements in Space Applications, A.A. Volinsky, V. Timoshenko, V. Nikolaenko, V. Morozov, Mat. Res. Soc. Symp. Proc. Vol. 851, NN1.4, 2004

  31. FIB Failure Analysis of Memory Arrays, A.A. Volinsky, L. Rice, W. Qin, N.D. Theodore, Microelectronic Engineering, Vol. 71/1, pp. 3-11, 2004

  32. Gate Oxide Metrology and Silicon Piezooptics, S. Zollner, R. Liu, A.A. Volinsky, B.-Y. Nguyen, C.S. Cook, Thin Solid Films 455-456, pp. 261-265, 2004

  33. Irradiated Cubic Single Crystal SiC as a High Temperature Sensor, A.A. Volinsky, L. Ginzbursky, Mat. Res. Soc. Symp. Proc. Vol. 792, R5.3 2003

  34. Fracture Patterns in Thin Films and Multilayers, A.A. Volinsky, D.C. Meyer, T. Leisegang, P. Paufler, Mat. Res. Soc. Symp. Proc. Vol. 795, U3.8 2003

  35. Application of FIB/SEM and TEM to Single Bit Failure Analysis in SRAM arrays, W. Qin, A.A. Volinsky, L. Rice, L. Johnston, N.D. Theodore, Mat. Res. Soc. Symp. Proc. Vol. 782, A5.77 2003

  36. Oxide Reduction in Advanced Metal Stacks for Microelectronic Applications, W. Qin, A.A. Volinsky, D. Werho, N. D. Theodore, Mat. Res. Soc. Symp. Proc. Vol. 786, E6.33 2003

  37. Optical and Dielectric Properties of Eu- and Y-Polytantalate Thin Films, V. Vasilyev, A. Drehman, H. Dauplaise, L. Bouthillette , M. Roland, A. Volinsky, S. Zollner, and W. Qin, Mat. Res. Soc. Symp. Proc. Vol. 786, E6.33 2003

  38. Tensile Crack Patterns in Mo/Si Multilayers on Si Substrates Under High-temperature Bending, D.C. Meyer, T. Leisegang, A.A. Levin, P. Paufler, A.A. Volinsky, Appl. Phys. A 78, pp. 303-305, 2004

  39. Nanoindentation of Au and Pt/Cu Thin Films at Elevated Temperatures, A.A. Volinsky, N.R. Moody, W.W. Gerberich, accepted Journal of Materials Research, June 2003

  40. TEM Study of Spontaneous Surface Oxide Reduction in Metal Stacks, W. Qin, A.A. Volinsky, N.D. Theodore, Thin Solid Films 473, pp. 236-240, 2005

  41. Mechanical Reliability and Characterization of Modern Microelectronic Interconnect Structures, A.A. Volinsky, Nano-Engineering World Forum Proceedings, Marlborough MA, 2003

  42. Plasticity Effects on Interfacial Fracture of Thin Gold Films, N.R. Moody, D.P. Adams, M. Cordill, D.F. Bahr, A.A. Volinsky, Symposium on Thin Films, ICM-9, 9th International Conference on the Mechanical Behavior of Materials Proceedings, Geneva Switzerland, 2003

  43. Effects of Near-Tip Rotation on Pre-Buckle Crack Growth of Compressed Beams Bonded to a Rigid Substrate, Q.D. Yang, A.A. Volinsky, International Journal of Solids and Structures 41, pp. 2711-2729, 2004

  44. Nanoindentation Methods in Interfacial Fracture Testing, Chapter 13 in Comprehensive Structural Integrity (I. Milne, R.O. Ritchie, B. Karihaloo, Editors-in-Chief), Volume 8: Interfacial and Nanoscale Failure (W.W. Gerberich, W. Yang, editors), A.A. Volinsky, D.F. Bahr, M.D. Kriese, N.R. Moody, W.W. Gerberich, Elsevier 2003

  45. Characterization Techniques for Evaluating Strained Si CMOS Materials, Q. Xie, R. Liu, X. Wang, M. Canonico, E. Duda, S. Lu, C. Cook, A. Volinsky, S. Zollner, S. G. Thomas, T. White, A. Barr, M. Sadaka, and B. Nguyen, AIP Conference Proceedings Vol 683(1) pp. 223-227 2003

  46. “Incompressible” pore effect on the mechanical behavior of Low-K dielectric films, A.A. Volinsky, M.B. Palacio, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 750, Y9.9, 2003

  47. Experiments with In-situ Thin Film Phone Cord Delamination Propagation, A.A. Volinsky, Mat. Res. Soc. Symp. Proc. Vol. 749, W10.7, 2003

  48. Nanoindentation Techniques for Assessing Mechanical Reliability at Nanoscale, A.A. Volinsky and W.W. Gerberich, Microelectronic Engineering, Vol. 69/2-4, pp. 519-527, 2003

  49. Effects of Diffusion on Interfacial Fracture of Gold-chromium Hybrid Microcircuit Film, N.R. Moody, D.P. Adams, D. Medlin, T. Headley, N. Yang, A.A. Volinsky, International Journal of Fracture, Vol. 119, No. 4, pp. 407-419, 2003

  50. Mechanical Properties and Fracture Toughness of Organo-silicate Glass (OSG) Low-k Dielectric Thin Films for Microelectronic Application, J.B. Vella, I.S. Adhihetty, K. Junker, and A.A. Volinsky, International Journal of Fracture, Vol. 119, No. 4, pp. 487-499, 2003

  51. Length Scales for the Fracture of Nanostructures, W.W. Gerberich, J.M. Jungk, M. Li, A.A Volinsky, J.W. Hoehn, K.Yoder, International Journal of Fracture, Vol. 119, No. 4, pp. 387-405, 2003

  52. Fiducial Mark and CTOA Estimates of Thin Film Adhesion, A.A. Volinsky, N.R. Moody, W.W. Gerberich, International Journal of Fracture, Vol. 119, No. 4, pp. 431-439, 2003

  53. Nanoindentation of Silicate Low-K Dielectric Thin Films. J.B. Vella, A.A. Volinsky, I.S. Adhihetty, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 716, B12.12, 2002

  54. Residual Stress and Microstructure of Electroplated Cu Film on Different Barrier Layers, A.A. Volinsky, M. Hauschildt, J.B. Vella, N.V. Edwards, R. Gregory, WW. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 695, pp. 27-32, 2002

  55. Fracture Toughness, Adhesion And Mechanical Properties of Low-K Dielectric Thin Films Measured by Nanoindentation, A.A. Volinsky, J.B. Vella, W.W. Gerberich, Thin Solid Films 429/1-2 pp. 201-210, 2002

  56. Fiducial Mark and Nanocrack Zone Formation During Thin Film Delamination, A.A. Volinsky, N.R. Moody, M.L. Kottke, W.W. Gerberich, Philosophical Magazine A, Vol. 82, No. 17/18, pp. 3383-3391, 2002

  57. Fiducial Marks as Measures of Thin Film Crack Arrest Toughness, A.A. Volinsky, M.L. Kottke, N.R. Moody, I.S. Adhihetty, W.W. Gerberich, 10th International Congress on Fracture, Honolulu, HI, 2001

  58. Crack Arrest Toughness Assessment Through Thin Film Fiducial Marks, A.A. Volinsky, M.L. Kottke, N.R. Moody, W.W. Gerberich, Engineering Fracture Mechanics Vol. 69, No. 13, pp. 1511-1515, 2002

  59. Mechanical Properties, Adhesion, and Fracture Toughness of Low-K Dielectric Thin Films for Microelectronic Applications, I.S. Adhihetty, J.B. Vella, A.A. Volinsky, C. Goldberg, W.W. Gerberich, 10th International Congress on Fracture Proceedings (ICF10), Honolulu, HI, 2001

  60. Effects of Diffusion on Interfacial Fracture of Multilayer Hybrid Microcircuit Films, N.R. Moody, D. P. Adams, D. Medlin, A.A. Volinsky , N. Yang, W.W. Gerberich, 10th International Congress on Fracture, Honolulu, HI, 2001

  61. Interfacial Toughness Measurements for Thin Films on Substrates, A.A. Volinsky, N.R. Moody, W.W. Gerberich, Acta Mater. Vol. 50/3, pp. 441-466, 2002 One of the most cited recent papers in the field of Materials Science determined by ISI®

  62. Substrate Effects on Indentation Plastic Zone Development in Thin Soft Films, D.E. Kramer, A.A. Volinsky, N.R. Moody, W.W. Gerberich, Journal of Materials Research, Vol. 16, No. 11, p 3150-3157, 2001

  63. Finite Element Analysis of the Precracked Line Scratch Test, A.A. Volinsky, L. Mercado, V. Sarihan, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 657, pp. EE591-EE596, 2000

  64. Microstructure and Mechanical Properties of Electroplated Cu Thin Films, A.A. Volinsky, J. Vella, I.S. Adhihetty, V. Sarihan, L. Mercado, B.H. Yeung, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 649, Q5.3, 2000

  65. Adhesion Quantification of Post-CMP Copper to Amorphous SiN Passivation by Nanoindentation, J.B. Vella, A.A. Volinsky, I.S. Adhihetty, S.M. Smith Mat. Res. Soc. Symp. Proc. Vol. 649, pp. Q6.1.1-Q6.1.6, 2000

  66. Indentation-Induced Ductile Film Interfacial Debonding, A.A. Volinsky, W.M. Clift, N.R. Moody, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 586, p 255-260, 2000

  67.  A Brittle to Ductile Transition (BDT) in Adhered Thin Films, W.W. Gerberich, A.A. Volinsky, N.I. Tymiak, N.R. Moody, Mat. Res. Soc. Symp. Proc. Vol. 594, p 351-364, 2000

  68.  Annealing Effects on Interfacial Fracture of Gold-Chromium Films in Hybrid Microcircuits, N.R. Moody, D. Adams, A.A. Volinsky, M. Kriese, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 586, p 195-206, 2000

  69. Superlayer Residual Stress Effect on the Indentation Adhesion Measurements, A.A. Volinsky, N.R. Moody, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 594, p 383-388, 2000

  70. Acoustic Emission Analysis of Fracture Events in Cu Films with W Overlayer, A.A. Volinsky, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 563, p 275-284, 1999

  71. Macroscopic Modeling of Fine Lines Adhesion Tests, A.A. Volinsky, J.C. Nelson, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 563, p 297-302, 1999

  72. Environmental Effects on Cu/SiO2 and Cu/Ti/SiO2 Thin Film Adhesion, N.I. Tymiak, M. Li, A.A. Volinsky, Y. Katz, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol.563, p 269-274, 1999

  73. Nanoindentation-Induced Defect-Interface Interactions: Phenomena, Methods and Limitations, W.W. Gerberich, D. Kramer, N. Tymiak, A.A. Volinsky, D.F. Bahr, and M. Kriese, Acta mater. 47(15), p. 4115-23, 1999

  74. The Role of Plasticity in Bi-material Fracture With Ductile Interlayers, N.I. Tymiak, A.A. Volinsky, M.D. Kriese, S.A. Downs and W.W. Gerberich, Metallurgical and Materials Transactions A; Vol. 31A; No. 3A; pp 863-872A, 2000

  75. Quantitative modeling and Measurement of Copper Thin Film Adhesion, A.A. Volinsky, N.I. Tymiak, M.D. Kriese, W.W. Gerberich and J.W. Hutchinson, Mat. Res. Soc. Symp. Proc. Vol. 539, pp. 277-290, 1999

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