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Publications

  1. Resonant Modes and Magnetoelectric Performance of PZT/Ni Cylindrical Layered Composites, D.A. Pan, S.G. Zhang, J.J. Tian, J.S. Sun, A.A. Volinsky, L.J. Qiao, Applied Physics A, Vol. 98, No. 2, pp. 449-454, 2010

  2. Heat Treatment Effects on Microstructure and Magnetic Properties of Mn-Zn Ferrite Powders, P. Hu, H. Yang, D.A. Pan, H. Wang, J. Tian, S. Zhang, X. Wang, A.A. Volinsky, Journal of Magnetism and Magnetic Materials, Vol. 322(1), pp. 173-177, 2010

  3. Geometry Effects on Magnetoelectric Performance of Layered Ni/PZT Composites, D.A. Pan, J.J. Tian, S.G. Zhang, J.S. Sun, A.A. Volinsky, L.J. Qiao, Mater. Sci. Eng. B, Vol. 163(2), pp. 114-119, 2009

  4. Measurements for Mechanical Reliability of Thin Films, D.T. Read and A.A. Volinsky, NATO Science for Peace and Security Series C: Environmental Security, Security and Reliability of Damaged Structures and Defective Materials, (G. Pluvinage, A. Sedmak, editors), Springer Netherlands, pp. 337-358, 2009

  5. Compliant MEMS Device Actuation and Fracture, A.A. Volinsky, D. Ke, C. Lusk, 12th International Congress on Fracture Proceedings, Ottawa, Canada, 2009

  6. Investigation of Microstructure and Mechanical Properties of Multi-layer Cr/Cr2O3 Coatings, X. Pang, K. Gao, F. Luo, Y. Emirov, A.A. Levin, A.A. Volinsky, Thin Solid Films, Vol. 517, pp. 1922-1927, 2009

  7. Simple Model of the Magnetoelectric Effect in Layered Cylindrical Composites, D.A. Pan, S.G. Zhang, A.A. Volinsky, L.J. Qiao, J. Phys. D: Appl. Phys., Vol. 41, No. 20, 205008, 2008

  8. Temperature Effect on Pump Oil and Alkanes Evaporation, N.A. Waldstein, A.A. Volinsky, Mat. Res. Soc. Symp. Proc. Vol. 1151E, SS3.4, 2008

  9. Electro-deposition Current Density Effect on Ni/PZT Layered Magnetoelectric Composites Performance, D.A. Pan, S.G. Zhang, A.A. Volinsky, L.J. Qiao, J. Phys. D: Appl. Phys., Vol. 41, No. 19, 195004, 2008

  10. Mechanical Properties of Evaporated Gold Films. Hard Substrate Effect Correction, K. Du, X. Pang, C. Chen, A.A. Volinsky, Mat. Res. Soc. Symp. Proc. Vol. 1086E, U8.41, 2008

  11. Shape and Size Effects on Layered Ni/PZT/Ni Composites Magnetoelectric Performance, D.A. Pan, S.G. Zhang, A.A. Volinsky, L.J. Qiao, J. Phys. D: Appl. Phys., Vol. 41, No. 17, 172003, 2008

  12. Residual Stress in CVD-grown 3C-SiC Films on Si Substrates, A.A. Volinsky, G. Kravchenko, P. Waters, J. Deva Reddy, C. Locke, C. Frewin, S.E. Saddow, Mat. Res. Soc. Symp. Proc. Vol. 1069, D3.5, 2008

  13. Concentric Ring Pattern Formation in Heated Chromium-gold Thin Films on Silicon, J.S. Randhawa, A. Bernfeld, M. Keung, A.A. Volinsky, D.H. Gracias, Appl. Phys Lett., Vol. 92, p. 211907, 2008

  14. Moisture Effects on Gold Nanowear, M. Pendergast, A.A. Volinsky, X. Pang, R. Shields, Mat. Res. Soc. Symp. Proc. Vol. 1085E, T5.10, 2008

  15. Elastic Anisotropy Effect on Indentation-induced Thin Film Interfacial Delamination, B. Yang, A.A. Volinsky, Engineering Fracture Mechanics, Vol. 75, No. 10 pp. 3121-3130, 2008

  16. Adhesion and Friction of Chromium Oxide Coatings in Air and in Water, X. Pang, A.A. Volinsky, K. Gao, NACE International Corrosion 2008 Conference Proceedings, Paper 01555, March 16-20, New Orleans, LA, 2008

  17. Annealing Effects on Microstructure and Mechanical Properties of Chromium Oxide Coatings, X. Pang, F. Luo, H. Yanga, Y. Wanga, K. Gao, A.A. Volinsky, Thin Solid Films, Vol. 516, pp. 4685-4689, 2008

  18. Giant Magnetoelectric Effect in Ni-PZT Composite Cylindrical Structure, D.A. Pan, Y. Bai, A.A. Volinsky, W.Y. Chu, L.J. Qiao, Appl. Phys. Lett., Vol. 92(5), p. 052904, 2008

  19. Mechanical Properties of Evaporated Gold Films. Hard Substrate Effect Correction , K. Du, X. Pang, C. Chen, A.A. Volinsky, Mat. Res. Soc. Symp. Proc. Vol. 1086E, U8.41, 2008

  20. Moisture Effects on Gold Nanowear, M. Pendergast, A.A. Volinsky, X. Pang, R. Shields, Mat. Res. Soc. Symp. Proc. Vol. 1085E, T5.10, 2008

  21. Adhesion and Friction of Chromium Oxide Coatings in Air and in Water,X. Pang, A.A. Volinsky, K. Gao, NACE International Corrosion 2008 Conference Proceedings, Paper 01555, March 16-20, New Orleans, LA, 2008

  22. Tip-induced Calcite Single Crystal Nanowear, R. Gunda, A.A. Volinsky, Mat. Res. Soc. Symp. Proc. Vol. 1049, AA5.15, 2008

  23. Pattern Formation During Nanowear of Gold Films, M.E. Pendergast, X. Pang, A.A. Volinsky, Mat. Res. Soc. Symp. Proc. Vol. 1059E, KK10.3, 2008

  24. Mechanical Properties of Single and Polycrystalline SiC Thin Films, J. Deva Reddy, A.A. Volinsky, C. Frewin, C. Locke, S.E. Saddow, Mat. Res. Soc. Symp. Proc. Vol. 1049, AA3.6, 2008

  25. Electrowetting Forces in an Electrowetting-Driven Oscillator, N.B. Crane, A.A. Volinsky, V. Ramadoss, M. Nellis, P. Mishra, X. Pang, Mat. Res. Soc. Symp. Proc. Vol. 1052, DD8.1, 2008

  26. Compliant MEMS Motion Characterization by Nanoindentation, J.G. Choueifati, C. Lusk, X. Pang, A.A. Volinsky, Mat. Res. Soc. Symp. Proc. Vol. 1052, DD6.24, 2008

  27. Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability,D.T. Read and A.A. Volinsky, Chapter 4 in Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, Volume 1 Materials Physics / Materials Mechanics, edited by Ephraim Suhir, Ephraim, Y.C. Lee, and C.P. Wong, Springer, New York, pp. 135-180, January, 2007

  28. Microstructure and Mechanical Properties of Chromium Oxide Coatings, X. Pang, A.A. Volinsky, K. Gao, Journal of Materials Research, Vol. 22, No. 12, pp. 3531- 3537, 2007

  29. Interfacial Microstructure of Chromium Oxide Coatings, X. Pang, K. Gao, H. Yang, L. Qiao, Y. Wang, A.A. Volinsky, Advanced Engineering Materials, Vol. 9, No. 7, pp. 594-599, 2007

  30. Nanoripples Formation in Single Crystals, M.E. Pendergast, R. Gunda, A.A. Volinsky, Mat. Res. Soc. Symp. Proc. Vol. 1021E, HH5.9, 2007

  31. Stress and Moisture Effects on Thin Film Buckling Delamination, P. Waters, A.A. Volinsky, Experimental Mechanics, Vol. 47, No. 1, 2006

  32. Mechanical Aspects of Anti-Corrosive Coatings Performance Tests, A.A. Volinsky, NACE International Corrosion 2006 Conference Proceedings, Paper 06041, March 12-16, San Diego, CA, 2005

  33. Novel Adhesion Test for Environmentally Assisted Fracture in Thin Films, A.A. Volinsky and P. Waters, Tri-Service Conference on Corrosion, November 14-18, 2005, Orlando, FL Proceedings Paper 06T104, 2005

  34. Application of the Standard Porosimetry Method for Nanomaterials, Y.M. Volfkovich, A.V. Sakars and A.A. Volinsky, International Journal of Nanotechnology, Vol. 2, No. 3, pp. 292-302, 2005

  35. Moisture Effects on Copper Thin Film Adhesion, P.J. Waters, A.A. Volinsky, Proceedings of IMECE: ASME 2005 Nov. 5-11, 2005

  36. Stress-Induced Periodic Fracture Patterns in Thin Films, A.A. Volinsky, N.R. Moody, D.C. Meyer, 11th International Congress on Fracture Proceedings, Turin, Italy, 2005

  37. Micro-fluidics Applications of Telephone Cord Delamination Blisters, A.A. Volinsky, P. Waters, G. Wright, Mat. Res. Soc. Symp. Proc. Vol. 855E, W3.16, 2004

  38. Sub-Critical Telephone Cord Delamination Propagation, A.A. Volinsky, P. Waters, J.D. Kiely, E. Johns, Mat. Res. Soc. Symp. Proc. Vol. 854E, U9.5, 2004

  39. Irradiated Single Crystals for High Temperature Measurements in Space Applications, A.A. Volinsky, V. Timoshenko, V. Nikolaenko, V. Morozov, Mat. Res. Soc. Symp. Proc. Vol. 851, NN1.4, 2004

  40. FIB Failure Analysis of Memory Arrays, A.A. Volinsky, L. Rice, W. Qin, N.D. Theodore, Microelectronic Engineering, Vol. 71/1, pp. 3-11, 2004

  41. Gate Oxide Metrology and Silicon Piezooptics, S. Zollner, R. Liu, A.A. Volinsky, B.-Y. Nguyen, C.S. Cook, Thin Solid Films 455-456, pp. 261-265, 2004

  42. Irradiated Cubic Single Crystal SiC as a High Temperature Sensor, A.A. Volinsky, L. Ginzbursky, Mat. Res. Soc. Symp. Proc. Vol. 792, R5.3 2003

  43. Fracture Patterns in Thin Films and Multilayers, A.A. Volinsky, D.C. Meyer, T. Leisegang, P. Paufler, Mat. Res. Soc. Symp. Proc. Vol. 795, U3.8 2003

  44. Application of FIB/SEM and TEM to Single Bit Failure Analysis in SRAM arrays, W. Qin, A.A. Volinsky, L. Rice, L. Johnston, N.D. Theodore, Mat. Res. Soc. Symp. Proc. Vol. 782, A5.77 2003

  45. Oxide Reduction in Advanced Metal Stacks for Microelectronic Applications, W. Qin, A.A. Volinsky, D. Werho, N. D. Theodore, Mat. Res. Soc. Symp. Proc. Vol. 786, E6.33 2003

  46. Optical and Dielectric Properties of Eu- and Y-Polytantalate Thin Films, V. Vasilyev, A. Drehman, H. Dauplaise, L. Bouthillette , M. Roland, A. Volinsky, S. Zollner, and W. Qin, Mat. Res. Soc. Symp. Proc. Vol. 786, E6.33 2003

  47. Tensile Crack Patterns in Mo/Si Multilayers on Si Substrates Under High-temperature Bending, D.C. Meyer, T. Leisegang, A.A. Levin, P. Paufler, A.A. Volinsky, Appl. Phys. A 78, pp. 303-305, 2004

  48. Nanoindentation of Au and Pt/Cu Thin Films at Elevated Temperatures, A.A. Volinsky, N.R. Moody, W.W. Gerberich, Journal of Materials Research, Vol. 18, No. 9, pp. 2650-2657, 2004

  49. TEM Study of Spontaneous Surface Oxide Reduction in Metal Stacks, W. Qin, A.A. Volinsky, N.D. Theodore, Thin Solid Films 473, pp. 236-240, 2005

  50. Mechanical Reliability and Characterization of Modern Microelectronic Interconnect Structures, A.A. Volinsky, Nano-Engineering World Forum Proceedings, Marlborough MA, 2003

  51. Plasticity Effects on Interfacial Fracture of Thin Gold Films, N.R. Moody, D.P. Adams, M. Cordill, D.F. Bahr, A.A. Volinsky, Symposium on Thin Films, ICM-9, 9th International Conference on the Mechanical Behavior of Materials Proceedings, Geneva Switzerland, 2003

  52. Effects of Near-Tip Rotation on Pre-Buckle Crack Growth of Compressed Beams Bonded to a Rigid Substrate, Q.D. Yang, A.A. Volinsky, International Journal of Solids and Structures 41, pp. 2711-2729, 2004

  53. Nanoindentation Methods in Interfacial Fracture Testing, Chapter 13 in Comprehensive Structural Integrity (I. Milne, R.O. Ritchie, B. Karihaloo, Editors-in-Chief), Volume 8: Interfacial and Nanoscale Failure (W.W. Gerberich, W. Yang, editors), A.A. Volinsky, D.F. Bahr, M.D. Kriese, N.R. Moody, W.W. Gerberich, Elsevier 2003

  54. Characterization Techniques for Evaluating Strained Si CMOS Materials, Q. Xie, R. Liu, X. Wang, M. Canonico, E. Duda, S. Lu, C. Cook, A. Volinsky, S. Zollner, S. G. Thomas, T. White, A. Barr, M. Sadaka, and B. Nguyen, AIP Conference Proceedings Vol 683(1) pp. 223-227 2003

  55. “Incompressible” pore effect on the mechanical behavior of Low-K dielectric films, A.A. Volinsky, M.B. Palacio, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 750, Y9.9, 2003

  56. Experiments with In-situ Thin Film Phone Cord Delamination Propagation, A.A. Volinsky, Mat. Res. Soc. Symp. Proc. Vol. 749, W10.7, 2003

  57. Nanoindentation Techniques for Assessing Mechanical Reliability at Nanoscale, A.A. Volinsky and W.W. Gerberich, Microelectronic Engineering, Vol. 69/2-4, pp. 519-527, 2003

  58. Effects of Diffusion on Interfacial Fracture of Gold-chromium Hybrid Microcircuit Film, N.R. Moody, D.P. Adams, D. Medlin, T. Headley, N. Yang, A.A. Volinsky, International Journal of Fracture, Vol. 119, No. 4, pp. 407-419, 2003

  59. Mechanical Properties and Fracture Toughness of Organo-silicate Glass (OSG) Low-k Dielectric Thin Films for Microelectronic Application, J.B. Vella, I.S. Adhihetty, K. Junker, and A.A. Volinsky, International Journal of Fracture, Vol. 119, No. 4, pp. 487-499, 2003

  60. Length Scales for the Fracture of Nanostructures, W.W. Gerberich, J.M. Jungk, M. Li, A.A Volinsky, J.W. Hoehn, K.Yoder, International Journal of Fracture, Vol. 119, No. 4, pp. 387-405, 2003

  61. Fiducial Mark and CTOA Estimates of Thin Film Adhesion, A.A. Volinsky, N.R. Moody, W.W. Gerberich, International Journal of Fracture, Vol. 119, No. 4, pp. 431-439, 2003

  62. Nanoindentation of Silicate Low-K Dielectric Thin Films. J.B. Vella, A.A. Volinsky, I.S. Adhihetty, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 716, B12.12, 2002

  63. Residual Stress and Microstructure of Electroplated Cu Film on Different Barrier Layers, A.A. Volinsky, M. Hauschildt, J.B. Vella, N.V. Edwards, R. Gregory, WW. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 695, pp. 27-32, 2002

  64. Fracture Toughness, Adhesion And Mechanical Properties of Low-K Dielectric Thin Films Measured by Nanoindentation, A.A. Volinsky, J.B. Vella, W.W. Gerberich, Thin Solid Films 429/1-2 pp. 201-210, 2002

  65. Fiducial Mark and Nanocrack Zone Formation During Thin Film Delamination, A.A. Volinsky, N.R. Moody, M.L. Kottke, W.W. Gerberich, Philosophical Magazine A, Vol. 82, No. 17/18, pp. 3383-3391, 2002

  66. Fiducial Marks as Measures of Thin Film Crack Arrest Toughness, A.A. Volinsky, M.L. Kottke, N.R. Moody, I.S. Adhihetty, W.W. Gerberich, 10th International Congress on Fracture, Honolulu, HI, 2001

  67. Crack Arrest Toughness Assessment Through Thin Film Fiducial Marks, A.A. Volinsky, M.L. Kottke, N.R. Moody, W.W. Gerberich, Engineering Fracture Mechanics Vol. 69, No. 13, pp. 1511-1515, 2002

  68. Mechanical Properties, Adhesion, and Fracture Toughness of Low-K Dielectric Thin Films for Microelectronic Applications, I.S. Adhihetty, J.B. Vella, A.A. Volinsky, C. Goldberg, W.W. Gerberich, 10th International Congress on Fracture Proceedings (ICF10), Honolulu, HI, 2001

  69. Effects of Diffusion on Interfacial Fracture of Multilayer Hybrid Microcircuit Films, N.R. Moody, D. P. Adams, D. Medlin, A.A. Volinsky , N. Yang, W.W. Gerberich, 10th International Congress on Fracture, Honolulu, HI, 2001

  70. Interfacial Toughness Measurements for Thin Films on Substrates, A.A. Volinsky, N.R. Moody, W.W. Gerberich, Acta Mater. Vol. 50/3, pp. 441-466, 2002 One of the most cited recent papers in the field of Materials Science determined by ISI®

  71. Substrate Effects on Indentation Plastic Zone Development in Thin Soft Films, D.E. Kramer, A.A. Volinsky, N.R. Moody, W.W. Gerberich, Journal of Materials Research, Vol. 16, No. 11, p 3150-3157, 2001

  72. Finite Element Analysis of the Precracked Line Scratch Test, A.A. Volinsky, L. Mercado, V. Sarihan, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 657, pp. EE591-EE596, 2000

  73. Microstructure and Mechanical Properties of Electroplated Cu Thin Films, A.A. Volinsky, J. Vella, I.S. Adhihetty, V. Sarihan, L. Mercado, B.H. Yeung, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 649, Q5.3, 2000

  74. Adhesion Quantification of Post-CMP Copper to Amorphous SiN Passivation by Nanoindentation, J.B. Vella, A.A. Volinsky, I.S. Adhihetty, S.M. Smith Mat. Res. Soc. Symp. Proc. Vol. 649, pp. Q6.1.1-Q6.1.6, 2000

  75. Indentation-Induced Ductile Film Interfacial Debonding, A.A. Volinsky, W.M. Clift, N.R. Moody, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 586, p 255-260, 2000

  76.  A Brittle to Ductile Transition (BDT) in Adhered Thin Films, W.W. Gerberich, A.A. Volinsky, N.I. Tymiak, N.R. Moody, Mat. Res. Soc. Symp. Proc. Vol. 594, p 351-364, 2000

  77.  Annealing Effects on Interfacial Fracture of Gold-Chromium Films in Hybrid Microcircuits, N.R. Moody, D. Adams, A.A. Volinsky, M. Kriese, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 586, p 195-206, 2000

  78. Superlayer Residual Stress Effect on the Indentation Adhesion Measurements, A.A. Volinsky, N.R. Moody, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 594, p 383-388, 2000

  79. Acoustic Emission Analysis of Fracture Events in Cu Films with W Overlayer, A.A. Volinsky, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 563, p 275-284, 1999

  80. Macroscopic Modeling of Fine Lines Adhesion Tests, A.A. Volinsky, J.C. Nelson, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol. 563, p 297-302, 1999

  81. Environmental Effects on Cu/SiO2 and Cu/Ti/SiO2 Thin Film Adhesion, N.I. Tymiak, M. Li, A.A. Volinsky, Y. Katz, W.W. Gerberich, Mat. Res. Soc. Symp. Proc. Vol.563, p 269-274, 1999

  82. Nanoindentation-Induced Defect-Interface Interactions: Phenomena, Methods and Limitations, W.W. Gerberich, D. Kramer, N. Tymiak, A.A. Volinsky, D.F. Bahr, and M. Kriese, Acta mater. 47(15), p. 4115-23, 1999

  83. The Role of Plasticity in Bi-material Fracture With Ductile Interlayers, N.I. Tymiak, A.A. Volinsky, M.D. Kriese, S.A. Downs and W.W. Gerberich, Metallurgical and Materials Transactions A; Vol. 31A; No. 3A; pp 863-872A, 2000

  84. Quantitative modeling and Measurement of Copper Thin Film Adhesion, A.A. Volinsky, N.I. Tymiak, M.D. Kriese, W.W. Gerberich and J.W. Hutchinson, Mat. Res. Soc. Symp. Proc. Vol. 539, pp. 277-290, 1999

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